Three-Layer Microfluidic Device Cools Small Electronics
A three-layer cooler etched in silicon pulls heat from dense chips while using little power, hinting that heat may no longer limit device size.
As electronic devices get smaller and more powerful, they release more heat in less volume, pushing device temperatures up and potentially damaging internal parts over time.
Heat is now a limiting factor for compact electronics used in computing, communication, defense, and consumer hardware, prompting the use of thermal management systems.
One promising approach for compact chips is microfluidic cooling, where fluid is pushed through microscopic channels near or within an integrated circuit to carry away heat.
However, many earlier microfluidic designs have limitations, either failing to remove enough heat at high power density or requiring high pumping power.
Heat may no longer limit device size.
Author's summary: New microfluidic cooler solves heat issue.
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